Non-contact Laser, Fiber-optic and Capacitance measurement systems for a wide variety of displacement, position, vibration and dimensional gaging applications. Browse our selection of non-contact tensile, compression and bending fixtures, precision signal source / function generators, eddy current and inductive systems and amplifier calibration fixtures.
Manual, semi-automated and fully automated metrology tools for measuring wafer thickness, bow, warp, resistivity, stress, site and global flatness of almost all materials. Browse all of our semiconductor metrology tools.
High speed vibration analysis and engine trim balance instruments and accessories for commercial and military aviation. These products quickly pinpoint engine problems and eliminate unnecessary engine removals. Fast hookup and bright color displays keep it simple. Browse our selection of high speed vibration measurement systems.
MTI Instruments is a worldwide leader in the design, manufacture and engineering of non-contact measurement systems and sensors. MTII’s main products consist of computerized general gauging instruments for position, displacement, thickness and vibration applications based on laser triangulation, fiber-optic and capacitance measurement technologies. The Semiconductor Products sensor group manufactures manual, semi-automated and fully automated wafer characterization tools designed to measure wafer thickness, total thickness variation (TTV), bow, warp and flatness of semi-insulating and semiconducting materials. MTII’s Aviation Balancing Instruments group provides state-of-the-art portable balancing and vibration analysis systems for turboprop and jet aircraft engines.
Whether your non-contact sensor application requires capacitance, fiber optic, laser triangulation or customized software MTII can offer the ideal solution to virtually any position, displacement, thickness or vibration sensing application.