Manual Semiconductor Wafer Measurement
Accurately measure 76 mm to 300 mm semiconductor wafer for TTV, thickness and bow. Cost effective manual metrology system.
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance
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