SearchSite Map
MTI Instruments
Company
Technology
Products
News & Events
MTI University
Contact Us
PROFORMA SERIES

Semiconductor Metrology Systems

PROFORMA SERIES 

Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates wafer diameters of 75 - 200 mm.

Download PROFORMA SERIES Brochure

Semi-Automated Wafer Measurement System for Semiconducting and Semi-Insulating Material

The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.

Easy to Use....

The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.

Wafer Specifications

  • Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm.
  • Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC.
  • Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
  • Flat/Notch: All SEMI Standard Flat(s) or Notch.
  • Conductivity: P or N Type.
  • Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.

Measurements

  • Thickness and TTV.
  • Bow.
  • Warp.
  • Site and Global Flatness

Advantages

  • Measures Different Materials such as, Si, Ge, GaAs, InP.
  • Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
  • Standard Windows® User Interface.

  • Slicing
    • Saw set-up
      • Thickness
      • TTV
    • Degradation monitoring
      • Wire guide re-grooving
      • Blade replacement
  • Lap/etch and polishing
    • Process monitoring
    • Thickness
    • TTV
    • Material removal
    • Bow
    • Warp
    • Flatness
  • Backgrind
    • Removal rate
  • Final Inspection
    • Lot sampling
    • Final thickness

  • MTI Instruments' exclusive Capacitance Circuitry for Outstanding Accuracy and Repeatability.
  • 75 to 200 mm. Wafers.
  • ASTM/SEMI Standard Measurements.
DescriptionApplicationFeaturesSpecificationsDrawingChart
magnifier picture

 Summary:

MTI Instruments Inc.
325 Washington Avenue Extension
Albany, NY 12205-5505 USA
Phone: 518-218-2550
Toll Free (US): 800-342-2203
Fax: 518-218-2506
E-mail:

Wafer Thickness Inspection Metrology, Computerized Semi-automated Precision Semiconductor Wafer Thickness/Surface Gaging, Non-contact Wafer Measurement, GaAs Gallium-Arsenide Surface Scanning/Characterization, TTV Measurement Gage, Noncontact Measuring, mil/mils, microinch/microinches, micron/microns, mm, millimeter/millimeters, Wafer Measurement Tools