Semiconductor Metrology Systems

PROFORMA SERIES

Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.

The ProformaTM 300 Advantage... One Package for ALL Wafer Sizes and Materials

Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:

Silicon
Gallium-Arsenide
Indium Phosphide
Germanium

... without recalibrating or electrically grounding the wafer!

Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)

Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.

Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.

An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.

The Proforma 300 is completely menu-driven. The on-board intelligence provides fast, accurate, repeatable measurements for all types of wafer materials. Maximum measurement range or maximum probe/wafer stand-off distance can also be adjusted to meet your specific requirements.

Menu-driven for Fast, Easy Setup.
Proprietary Push-PullTM Probe Technology.
High-resolution LCD Display.
On-board Microprocessor for Accurate, Repeatable Measurements.
Bubble Level.
Adjustable Stage for Precise Leveling.
Teflon Wafer Stage for Easy, Non-abrasive Positioning.

Measurements

Thickness.
Total Thickness Variation (TTV).
Bow
Continuous and 5-point Measurement.

Advantages

Measures Different Materials, such as Si, Ge, InP, and GaAs, Without Recalibration.
No Need to Electrically Ground the Wafer.
Easy to Set up and Operate - making it ideal for and Statistical Process Control (SPC).
Provides High Performance at Low Cost.
Can be Customized for Maximum Sensing Range or Maximum Stand-off from Target.

Slicing

Saw set-up

Thickness
TTV

Degradation monitoring

Wire guide re-grooving
Blade replacement

Lap/etch and polishing

Process monitoring
Thickness
TTV
Material removal

Backgrind

Removal rate

Final Inspection

Lot sampling
Final thickness

MTI Instruments' Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability.
Non-contact Measurements.
50-300 mm Diameter Wafer Range.
+/-0.25 µm Accuracy.
RS-232 Output Port to PC.
Parallel Port for Printer.

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A note about
forward looking statements

Forward-looking Statements: The statements contained on this website which are not purely historical are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including statements regarding the Company's beliefs, expectations, hopes or intentions regarding the future. Forward-looking statements on this website also include statements regarding any financial forecasts or market growth predictions. The Company assumes no obligation to update any forward-looking statement. It is important to note that actual outcomes and the Company's actual results could differ materially from those in such forward-looking statements. Factors that could cause actual results to differ materially include risks and uncertainties such as for example: the Company's need for additional financing, MTI Micro's ability to successfully develop direct methanol micro fuel cells (DMFCs), competition from other products and companies, market and OEM acceptance of DMFCs and the company's other products, early termination of MTI Micro's relationship with The Gillette Company, regulatory risks related to carrying methanol in the passenger compartment of airplanes, and the Company's ability to successfully introduce new products and maintain a technical advantage over its competitors. Readers should also refer to the risk disclosures outlined in the Company's filings with the Securities and Exchange Commissions on Forms 10-K and 10-Q.

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MTI Instruments Inc.
325 Washington Avenue Extension
Albany, NY 12205-5505 USA
Phone: 518-218-2550
Toll Free (US): 800-342-2203
Fax: 518-218-2506
E-mail:

Wafer Thickness Inspection Metrology, Digital Precision Semiconductor Wafer Thickness/Surface Gaging, Non-contact Wafer Measurement, GaAs Gallium-Arsenide Surface Scanning/Characterization, TTV Measurement Gage, Noncontact Measuring, mil/mils, microinch/microinches, micron/microns, mm, millimeter/millimeters