Semiconductor Metrology Systems

PROFORMA SERIES

Semi-automated wafer characterization system for measuring wafer thickness, TTV, bow warp, site and global flatness. The Proforma 300SA can be used for all wafer materials and accommodates 200mm and 300mm wafer diameters

The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.

Easy to Use....

The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs

Wafer Specifications

Diameter: 200mm and 300mm.
Material: All Semiconducting and Semi-insulating materials.
Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
Flat/Notch: All SEMI Standard Flat(s) or Notch.
Conductivity: P or N Type.
Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.

Measurements

Thickness and TTV.
Bow
Warp
Site and Global Flatness

Advantages

Cost effective alternative to fully automated tools.
Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
Standard Windows® User Interface.

Slicing

Saw set-up

Thickness
TTV

Degradation monitoring

Wire guide re-grooving
Blade replacement

Lap/etch and polishing

Process monitoring
Thickness
TTV
Material removal
Bow
Warp
Flatness

Backgrind

Removal rate

Final Inspection

Lot sampling
Final thickness

MTI Instruments' exclusive Capacitance Circuitry for Outstanding Accuracy and Repeatability.
200 mm and 300mm Wafers.
ASTM/SEMI Standard Measurements.

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A note about
forward looking statements

Forward-looking Statements: The statements contained on this website which are not purely historical are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including statements regarding the Company's beliefs, expectations, hopes or intentions regarding the future. Forward-looking statements on this website also include statements regarding any financial forecasts or market growth predictions. The Company assumes no obligation to update any forward-looking statement. It is important to note that actual outcomes and the Company's actual results could differ materially from those in such forward-looking statements. Factors that could cause actual results to differ materially include risks and uncertainties such as for example: the Company's need for additional financing, MTI Micro's ability to successfully develop direct methanol micro fuel cells (DMFCs), competition from other products and companies, market and OEM acceptance of DMFCs and the company's other products, early termination of MTI Micro's relationship with The Gillette Company, regulatory risks related to carrying methanol in the passenger compartment of airplanes, and the Company's ability to successfully introduce new products and maintain a technical advantage over its competitors. Readers should also refer to the risk disclosures outlined in the Company's filings with the Securities and Exchange Commissions on Forms 10-K and 10-Q.

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MTI Instruments Inc.
325 Washington Avenue Extension
Albany, NY 12205-5505 USA
Phone: 518-218-2550
Toll Free (US): 800-342-2203
Fax: 518-218-2506
E-mail:

Wafer Thickness Inspection Metrology, Digital Precision Semiconductor Wafer Thickness/Surface Gaging, Non-contact Wafer Measurement, GaAs Gallium-Arsenide Surface Scanning/Characterization, TTV Measurement Gage, Noncontact Measuring, mil/mils, microinch/microinches, micron/microns, mm, millimeter/millimeters