Semi-automated wafer characterization and inspection system for determining wafer surface thickness measurement, TTV, wafer bow warp, site, and global flatness measurement. The Proforma 300SA can be used for virtually any material including Silicon wafer (Si), Sapphire, Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP), and accommodates 150mm, 200mm, and 300mm wafer diameters.
The Proforma 300SA is a semi-automated metrology tool used in thickness measurement for both semiconducting and semi-insulating wafer materials. Capable of handling diameters of 150mm, 200mm, and 300mm, the Proforma 300SA provides highly accurate, repeatable measurements of thickness, TTV, wafer bow, warp, site, and wafer global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning and characterization at the press of a button. User defined and ASTM / SEMI scan patterns are used to generate a full 3-dimensional (3-D) image of the wafer.Wafer Metrology Demonstration Video
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each semiconductor wafer measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry / characterization. Customized data reports, as well as the ability to export wafer measurement data to any spreadsheet adds the ability to match the Proforma 300SA to your process needs.
| Wafer Specifications
MTI Instruments Inc.
325 Washington Avenue Extension
Albany, NY 12205-5505 USA
Toll Free (US): 800-342-2203