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PROFORMA SERIES

Semiconductor Metrology Systems

PROFORMA SERIES 

Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades.

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Fully Automated Wafer Measurement System for Semiconducting and Semi-insulating Materials

Based on MTI's exclusive Push-Pull capacitance technology, the AutoScan 200 delivers full wafer surface scanning with throughputs of up to 100 wafers per hour. The Autoscan provides highly accurate, repeatable measurements of both semiconducting and semi-insulating wafers from 75 mm to 200 mm in diameter. User-defined and ASTM/SEMI scan patterns are used to generate full 3-dimensional wafer images. To improve system upgradability and ease of service, the AutoScan takes full advantage of its modular design. Optional equipment is quickly and easily installed, maximizing system uptime.

Versatile Standard Features

The AutoScan 200 comes standard with two cassette stands that can be defined as input or output stations. An additional cassette stand is also available for greater capacity or wafer sorting. The Class 10 compatible pick and place robotic handling system is equipped with laser cassette scanning for non-contact detection of empty slots, crossovers and broken wafers. The integrated wafer pre-aligner is capable of detecting all SEMI standard notches and flats. To maximize available space, the AutoScan 200 is designed to deliver maximum capability with a minimal footprint. The Windows NT® -based controller PC built into the system offers three levels of security, from a production environment to full engineering analysis of wafer geometry. An on-board RJ-45 connector enables easy data transfer to any network, while an integrated Iomega ® zip drive adds data storage and backup capability.

Measurements

  • Thickness. TTV.
  • Bow.
  • Warp.
  • Resistivity.
  • Site and Global Flatness

Advantages

  • Outstanding Accuracy.
  • Integrated Design.

  • Slicing
    • Saw set-up
      • Thickness
      • TTV
    • Degradation monitoring
      • Wire guide re-grooving
      • Blade replacement
  • Lap/etch and polishing
    • Process monitoring
    • Thickness
    • TTV
    • Material removal
    • Bow
    • Warp
    • Flatness
  • Backgrind
    • Removal rate
  • Final Inspection
    • Lot sampling
    • Final thickness

  • Exclusive MTI Instruments capacitance sensors.
  • Measures all materials including Si, GaAs, Ge, InP, SiC.
  • 100 wafers/hour throughput.
  • Integrated control PC.
  • Modular design for future upgrades.
  • Enclosed environment for Class 10 compatibility.
  • SEMI S2-0200 health and safety compliant design.
  • SEMI S8-0999 ergonomic compliant design.
  • Integrated casters and leveling feet for portability.
  • Optional laser OCR mark reading and resistivity module.
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MTI Instruments Inc.
325 Washington Avenue Extension
Albany, NY 12205-5505 USA
Phone: 518-218-2550
Toll Free (US): 800-342-2203
Fax: 518-218-2506
E-mail:

Automated Wafer Thickness Inspection Metrology, Computerized Robotic Automated Precision Semiconductor Wafer Thickness/Surface Gaging, Non-contact Wafer Resistivity Measurement, GaAs Gallium-Arsenide Surface Scanning Machine, TTV Measurement Gage, Noncontact Measuring, mil/mils, microinch/microinches, micron/microns, mm, millimeter/millimeters