Proforma 300SA
Semi-automated wafer characterization and inspection system for determining wafer thickness measurement, TTV, wafer bow warp, site and global flatness measurement. The Proforma 300SA can be used for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). and accommodates 200mm and 300mm wafer diameters.
Proforma 200SA
Semi-automated, full wafer metrology system for surface scanning including wafer thickness, Total Thickness Variation (TTV), wafer bow, warp, site and global flatness measurement. The Proforma 200SA can be used for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP) and accommodates wafer diameters of 75mm - 200 mm.
Proforma 300
Manual, non-contact wafer metrology inspection system for wafer thickness measurement, Total Thickness Variation (TTV) and wafer bow. Portable and easy to set-up, the Proforma 300/G can measure virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP) and wafers mounted to sapphire or tape.
PV-1000
High-speed, multi-channel thickness, Total Thickness Variation (TTV) and wafer bow measurement module for in-process monitoring of solar / photovoltaic wafers and other materials. For applications requiring additional thickness channels or for unlimited line scans on solar / photovoltaic wafers, multiple PV-1000 measurement tools can be chained together.
