SearchSite Map
MTI Instruments
Company
Technology
Products
News & Events
MTI University
Contact Us

Semiconductor Metrology Systems

MTII's semiconductor metrology tools consist of a complete line of wafer measurement systems for virtually any material including Si, GaAs, Ge and InP. From manual to fully automated systems, the Proforma line of wafer tools are ideal for measuring wafer thickness, bow, warp, resistivity, site and global flatness. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII's solar metrology tools include off line manual systems for wafer thickness and TTV, as well as, in-process measurement systems capable of measuring wafer thickness, TTV and bow at the speed of 5 wafers/second.

Proforma 300SA

Proforma 300SA

Semi-automated wafer characterization system for measuring wafer thickness, TTV, bow warp, site and global flatness. The Proforma 300SA can be used for all wafer materials and accommodates 200mm and 300mm wafer diameters
View Product

Proforma 200SA

Proforma 200SA

Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates wafer diameters of 75 - 200 mm.
View Product

Proforma 300

Proforma 300

Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
View Product

PV-1000

PV-1000

High-speed, multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
View Product


 Summary:

MTI Instruments Inc.
325 Washington Avenue Extension
Albany, NY 12205-5505 USA
Phone: 518-218-2550
Toll Free (US): 800-342-2203
Fax: 518-218-2506
E-mail:

Automated/Tabletop or Robotic Wafer Thickness Inspection Metrology, Computerized Precision Semiconductor Wafer Thickness Gaging, Non-contact Wafer Surface Measurement, Silicon/GaAs/Gallium-Arsenide Wafers, Surface Scanning Equipment, TTV Measurement Gage, Electronic Noncontact Measuring Thickness of Wafers Systems/Equipment, mil/mils, microinch/microinches, micron/microns, mm, millimeter/millimeters, Photovoltaic wafer measurement, PV wafer measurement