Semi-automated Metrology System

Semi-automated Metrology System

Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness

Measures Thickness, TTV, Bow, Warp, Site and Global Flatness.

About the Semi-automated Metrology System

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The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials.  Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.

Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.

  • Wafer Specifications Diameter:  150 mm, 200 mm, 300 mm
  • Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
  • Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
  • Flat/Notch: All SEMI Standard Flat(s) or Notch
  • Conductivity: P or N Type
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