Semi-automated Metrology System
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
Measures Thickness, TTV, Bow, Warp, Site and Global Flatness
The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.
Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.
- Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm
- Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
- Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
- Flat/Notch: All SEMI Standard Flat(s) or Notch
- Conductivity: P or N Type
|Thickness||ASTM F533||+/- 500 µm||+/- 0.25 µm|
|TTV||ASTM F657||+/- 500 µm||+/- 0.25 µm|
|Bow||ASTM F534||+/- 250 µm||+/- 2.0 µm|
|Warp||ASTM F1390||+/- 250 µm||+/- 2.0 µm|
|Sori||ASTM F1451||+/- 250 µm||+/- 2.0 µm|
|Flatness (Site)||ASTM F1530||8 mm *||+/- 0.15 µm|
|Flatness (Global)||ASTM F1530||8 mm *||+/- 0.15 µm|
- Exclusive MTI capacitance sensors for outstanding accuracy and repeatability
- Full 1000 µm thickness measurement range without re-calibration
- Measures Thickness, TTV, Bow, Warp and site and Global Flatness
- Windows® user interface
- ASTM Standard measurements
- SEMI S2-0200 health and safety compliant design
- SEMI S8-0999 ergonomic compliant design
- Measures all materials including Si, GaAs, Ge, InP, SiC ***
*** provided bulk resistivity is less than 10K Ohm/cm
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At MTI Instruments, we offer advanced sensing and physical measurement technology in products that range from basic sensors to complete, fully integrated measurement systems.
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