Semi-automated Metrology System
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
Measures Thickness, TTV, Bow, Warp, Site and Global Flatness.
- Exclusive MTI capacitance sensors for outstanding accuracy and repeatability
- Full 1000 µm thickness measurement range without re-calibration
- Measures Thickness, TTV, Bow, Warp and site and Global Flatness
- Windows® user interface
- ASTM Standard measurements
- SEMI S2-0200 health and safety compliant design
- SEMI S8-0999 ergonomic compliant design
- Measures all materials including Si, GaAs, Ge, InP, SiC ***
*** provided bulk resistivity is less than 20K Ohm/cm
|Thickness||ASTM F533||+/- 500 µm||+/- 0.25 µm|
|TTV||ASTM F657||+/- 500 µm||+/- 0.25 µm|
|Bow||ASTM F534||+/- 250 µm||+/- 2.0 µm|
|Warp||ASTM F1390||+/- 250 µm||+/- 2.0 µm|
|Sori||ASTM F1451||+/- 250 µm||+/- 2.0 µm|
|Flatness (Site)||ASTM F1530||8 mm *||+/- 0.15 µm|
|Flatness (Global)||ASTM F1530||8 mm *||+/- 0.15 µm|
|Semiconductor||Surface||Wafer QA/QC after slicing and polishing|
Metrology Product Family Video – Watch Now
Proforma 300i SA Semi Automated Measurement Tool – Watch Now
Wafer TTV, thickness and bow measurement: Wafer characterization demonstration using MTI Proforma 300iSA – Watch Now
Proforma 300iSA Startup: Quickstart for Proforma 300iSA – Watch Now
Proforma 300iSA – How to guide: Features and usage of Proforma 300iSA – Watch Now
About the Semi-automated Metrology System
The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.
Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.
- Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm
- Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
- Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
- Flat/Notch: All SEMI Standard Flat(s) or Notch
- Conductivity: P or N Type
Would you like to contact MTI Instruments directly to learn more?
Looking for similar or complementary products? Browse the following products.
We make every effort, if feasible, to maintain, service and support our legacy products.