Semiconductor Metrology System
Undoubtedly an essential measurement tool for process automation, quality control and tool automation control.
Thickness and Bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.
*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance
- Front USB port enables easy data storage to flash drives
- MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability
- Non-contact Measurements
- 76-300 mm Diameter Wafer Range
- Optional wafer measurement rings
- Wafer stops for exact centering
- Ethernet interface
- Full remote control software (Windows compatible)
- Optional calibration wafers
|Product Info||Technical Specifications|
|P/N||Model||Measurement Range||Accuracy||Resolution||Interface||Type||Frequency Response||Request Info|
|8000-6760-001||Proforma 300i||1700µm (66.9mil/s)||±0.25 µm||0.05µm||RS232 and Ethernet||Desktop System||16.6Hz||Request Infomation on Proforma 300i|
|8000-6760-002||Proforma 300Gi||1700µm (66.9mil/s)||±0.25 µm||0.05µm||RS232 and Ethernet||Desktop System||16.6Hz||Request Infomation on Proforma 300Gi|
|Not finding what you’re looking for? MTI offers custom solutions More Info About MTI’s Custom Solutions|
Industries & Applications For This Product
GaAs substrate thickness measurement
Wafer Thickness, Bow, Warp and TTV
Wafer QA/QC after slicing and polishing
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