Semiconductor Metrology System

Semiconductor Metrology System 2017-08-23T18:10:23+00:00

Semiconductor Metrology System

Undoubtedly an essential measurement tool for process automation, quality control and tool automation control.

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Thickness and Bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape

The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.

*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance

Features

  • Front USB port enables easy data storage to flash drives
  • MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability
  • Non-contact Measurements
  • 76-300 mm Diameter Wafer Range
  • Optional wafer measurement rings
  • Wafer stops for exact centering
  • Ethernet interface
  • Full remote control software (Windows compatible)
  • Optional calibration wafers

Model Specifications

Product Info Technical Specifications
P/N Model Measurement Range Accuracy Resolution Interface Type Frequency Response Request Info
8000-6760-001 Proforma 300i 1700µm (66.9mil/s) ±0.25 µm 0.05µm RS232 and Ethernet Desktop System 16.6Hz Request Infomation on Proforma 300i
8000-6760-002 Proforma 300Gi 1700µm (66.9mil/s) ±0.25 µm 0.05µm RS232 and Ethernet Desktop System 16.6Hz Request Infomation on Proforma 300Gi
Not finding what you’re looking for? MTI offers custom solutions More Info About MTI’s Custom Solutions

Industries & Applications For This Product

Industry Measurement Type Applications
Semiconductor Thickness
GaAs substrate thickness measurement
Semiconductor Surface
Wafer Thickness, Bow, Warp and TTV
Semiconductor Surface
Wafer QA/QC after slicing and polishing
Semiconductor Surface
Wafer Characterization

Brochures

Semiconductor Metrology System
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Accessories

P/N Image Model Product Description
8000-6563 Base Rings (8000-6563) Image Base Rings 50.8mm (2″) Base rings are required for BOW measurements
8000-6552 Base Rings (8000-6552) Image Base Rings 76.2mm (3″) Base rings are required for BOW measurements
8000-6548 Base Rings (8000-6548) Image Base Rings 100mm (4″) Base rings are required for BOW measurements
8000-6553 Base Rings (8000-6553) Image Base Rings 125mm (5″) Base rings are required for BOW measurements
8000-6564 Base Rings (8000-6564) Image Base Rings 152.4mm (6″) Base rings are required for BOW measurements
8000-6565 Base Rings (8000-6565) Image Base Rings 203.25mm (8″) Base rings are required for BOW measurements
2000-2000 Mechanical Technology, Incorporated accessory placeholder image Calibration Standard Silicon (Si) wafer

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Manual Semiconductor Wafer Measurement

Accurately measure 76 mm to 300 mm semiconductor wafer for TTV, thickness and bow. Cost effective manual metrology system.
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Tutorial - Using the Proforma 300i

Perform bow, thickness and TTV measurement
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Technology Principles

At MTI Instruments, we offer advanced sensing and physical measurement technology in products that range from basic sensors to complete, fully integrated measurement systems.

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